Determination of the Curing Techniques of Octaepoxysilsesquioxane with a Diamine

Octaepoxysilsesquioxane (POSS-Ep), a kind of functional polyhedral oligomeric silsesquioxane (POSS) was cured with 4,4'-diaminodiphenylsulfone diamine (DDS) in this study. Possessing epoxy groups, it can be cured thermally with certain curing agents including amines. Differential scanning calorimetry (DSC) was used to determine the curing techniques of the POSS-Ep/DDS resin system in this study. The appropriate curing technique for this resin is set as: 130°C/2h+ 160°C/2h+200°C/2h.