Variation in heat sink shape for thermal analysis

The concern about the thermal performance of microelectronics is on the increase due to recent over-heating induced failures which have led to product recalls. Removal of excess heat from microelectronic systems with the use of heat sinks could improve thermal efficiency of the system. The shape of the heat sink model with difference fin configuration has significant influence on cooling performances. This paper investigates the effect of change in heat sink geometry on an electronic package through COMSOL Multiphysics software as well as the thermal performance of difference heat sink geometry corresponding to various air inlet velocities. Based on this study, plate fin heat sink has better thermal performance than strip pin fin and circular pin fin heat sink due to less obstruction of the heat sink design.