A semiconductor device having element portion and method of manufacturing the device

A semiconductor device comprising: - a semiconductor substrate (10); - is arranged an element portion (20) formed on the semiconductor substrate (10); and - is connected to a connecting portion (200) electrically connected to the semiconductor substrate (10) and made of a conductive material to provide an electrical connection to an external circuit, wherein - the connecting portion (200) is in direct contact with a surface of the semiconductor substrate (10), and - the connecting portion (200) and the semiconductor substrate (10) are electrically connected together.