Chemical and mechanical grinding rate control method

The invention relates to a chemical and mechanical grinding rate control method. When a grinding rate is regulated to a second grinding rate from a first grinding rate, the rotating speed of a grinding cushion and a pressure applied to a wafer are not changed, but the swing action of a grinding head is regulated to another movement state from a first movement state. When the grinding rate is regulated to the first grinding rate from the second grinding rate, the rotating speed of the grinding cushion and the pressure applied to the wafer are not changed either, but the swing action of the grinding head is regulated into the first movement state from the second movement state.