Fundamental studies of isotropic conductive adhesives focused on the current loadability of ICA for flip chip applications

The first part of the study focuses on fundamental investigations performed on printed ICA test structures (epoxy vs. thermoplastic resin). Measurings of the conductivity during cure have been made. The results have been related with DSC/TMA data. As well electrical performance of the cured adhesives under elevated temperature/humidity and high current loads have been determined. In the second part of the study first results obtained from high current tests on Flip Chip packages are presented. Limitations and mechanisms of failure are discussed.