Molecular Dynamics Simulation of the Dissociation Characteristics of Epoxy Resin under the Effect of PD Active Products Based on ReaxFF

Bisphenol F epoxy resin is the main material of the insulation of superconducting power equipment terminal. The epoxy resin in the terminal is under the coupling of a strong electric field and a large temperature gradient, which makes the partial discharge phenomenon more intense and reduces the thermal stability of superconducting state. In this paper, the aging dissociation characteristics and mechanism of epoxy materials cross-linked and cured by bisphenol F epoxy resin and DETDA under the action of active products of partial discharge are studied. The simulation results show that under the same conditions, under the action of two typical partial discharge active products of nitric acid and ozone, the thermal stability of the bisphenol F epoxy resin material decreases, the initial dissociation temperature decreases, and the average molecular weight of dissociation products decreases greatly.