Method and apparatus for producing a surface roughening copper plate, as well as surface roughening copper

A form a fine bump-like protrusions on both surfaces of the copper plate by way of roughening both sides of the copper plate, to provide a method for degradation of copper electroplating solution is hardly proceeds. To A in copper electroplating solution 2, the electrodes 3 of the same polarity placed opposite, by placing the copper plate 4 therebetween, the first copper plate 4 anode by electrolysis of the electrodes 3 and cathode anodic process to produce copper fine particles to both surfaces of the copper plate 4. Thereafter, the copper plate 4 cathode is performed by electrolytic copper plating to the electrodes 3 and the anode of the copper fine particles of the cathode process of fixing to the surface of the copper plate 4. By performing anodization and cathodic treatment of one or more cycles, to form the fine bump-like protrusions. .FIELD 1