Material heat conduction analysis device based on fluorescence method

The invention relates to a material heat conduction analysis device based on a fluorescence method, and belongs to the field of material thermal property analysis. The material heat conduction analysis device comprises a probe (1), a photoelectric module and a data processing module. The probe (1) is used for detecting fluorescence sensing materials (7) on an object to be tested and transmitting detected optical signals to the photoelectric module through optical fibers (2). The photoelectric module coverts the received optical signals into electric signals, and converts the electric signals into temperature signals and then transmits the temperature signals to the data processing module. The data processing module obtains a temperature change curve according to the temperature signals, obtains a thermal diffusion coefficient of the detected object through comparison with standard data, and transmits the thermal diffusion coefficient to an upper computer for heat conduction analysis. The material heat conduction analysis device can be applied to measurement of thermal diffusion coefficients of gas, liquid and solid, is simple in structure, high in flexibility, and has the advantages of being better in measurement accuracy and anti-electromagnetic interference capacity, and achieving functions of miniaturization, intellectualization and online monitoring.