MEMS (Micro Electro Mechanical System) microphone packaging structure

The utility model provides an MEMS microphone packaging structure. The packaging structure comprises a substrate, a first shielding casing, a microphone chip and a second shielding casing, wherein the first shielding casing is fixed to the substrate and internally provided with at least one metal layer, the microphone chip is arranged between the substrate and the first shielding casing, and the second shielding casing covers the first shielding casing, is internally provided with at least one metal layer and is fixed to the substrate. According to the MEMS microphone packaging structure, two shielding casings are assembled on the substrate, and the electronic shielding effect of an MEMS microphone is substantially improved.