Multiwavelength DFB-LD Array Module Using Self-aligned Solder Bump Bonding

Eight-wavelength 1.55-μm DFB-LD array modules with 1.6-nm wavelength spacing have been made by self-aligned assembly using a stripe-type solder bump flip-chip bonding, and the fiber output optical power for each channel was greater than ~20 dBm. These modules are attractive low-cost multiwavelength light sources for use in WDM systems.