Bonding with copper paste for pressure sintering process

Copper sintered material has been considered as the alternative to die joining and attaching. In this study, we develop the pressure-sintered Cu paste as a joining material to observe its property when proceeding a batch sintering process of multiple chips with different heights. High shear strength of each chip after sintering was found. The result shows that the Cu sinter paste can be applied to pressure sintering process for mass production.