The photosensitive resin composition, a photosensitive element, resist pattern manufacturing method of the forming method and printed wiring board

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which finely divides peeled chips (to reduce the size of resist chips after peeling) and which is excellent in plating resistance and excellent in sensitivity, resolution and adhesion, a photosensitive element using the same, a method for producing a resist pattern and a method for manufacturing a printed wiring board. SOLUTION: The photosensitive resin composition includes (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated group, and (C) a photopolymerization initiator, wherein the binder polymer (A) includes at least (meth)acrylic acid and a hydroxyalkyl (meth)acrylate as copolymerized components. The photosensitive resin composition preferably includes (D-1) benzotriazole and (D-2) a carboxybenzotriazole derivative represented by the following general formula (I) as (D) an adhesion imparting agent. COPYRIGHT: (C)2010,JPO&INPIT