Engineered substrate as a fast track to technology performance

2021 
Engineered substrates have proven performance boost for mobile phone front end module, where they became standard platform. Silicon Photonics going into significant volume manufacturing for high performance data centers, demonstrated how engineered substrate can be decisive in offering an integration support for device and light modules. Smart CutTM is now enabling new structures for Photonics application, longer wavelength, larger diameters and 3D integration opportunities, paving the way for combined performance at right cost of ownership.
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