Interaction between the third alloying element and the interfacial structure of AgCu-alloy brazed heterogeneous metal integration

Abstract Interface structures and behaviors are omnipresent in heterogeneous materials joining. Herein, we reveal that the third alloying element (typically Ti and In) would exert obvious effects not only on the interfacial structure between base material and filler, but also on the phase boundary properties of the main solid solution in the filler. The interface integration depends mainly on the bonding between Ag-based and Cu-based solid solution, which mainly originates from the hybridization among the p and d orbitals electrons. The emergence of Ti or In changes the electron orbital hybridization type between Ag-based and Cu based solid solution. Importantly, the In leads to the tightest electron cloud crossover and maximum interface separation energy, which results in the best mechanical performance (shear strength of ~300 MPa) of cemented carbide/316L stainless steel heterogeneous metal joint.