High-transparency high-deep-layer-curing-speed double-component condensed organic silicon potting adhesive

The invention relates to a high-transparency high-deep-layer-curing-speed double-component condensed organic silicon potting adhesive which comprises a component A and a component B, wherein the component A comprises hydroxyl-terminated polydimethylsiloxane and low-viscosity hydroxy silicon oil; and the component B comprises a crosslinking agent, a chain extender, a coupling agent and a catalyst. Compared with the existing condensed technique, no water or water-containing substance is added into the two components, the low-viscosity hydroxy silicon oil is condensed and dehydrated under the action of the catalyst when the components A and B are mixed, and the water participates into the reaction between the crosslinking agent and hydroxyl-terminated polydimethylsiloxane, thereby finally forming the crosslinked body; and therefore, the potting adhesive provided by the invention avoids transparency decrease due to the addition of the water or water-containing substance, the light transmittance is up to 90% above, and meanwhile, the water molecules which are generated and uniformly released in the A and B reaction process can enable the quick deep layer curing of the whole system. The potting adhesive provided by the invention is applicable to potting electronic components, is especially suitable for integral potting of LED (light-emitting diode) lamp bars, and has higher assembly efficiency.