Wafer level packaging structure, method and product for LED flip chip

The invention discloses a wafer level packaging structure, method and product for an LED flip chip. The wafer level packaging structure comprises the LED flip chip, a silicon substrate, a lens, a printed circuit board and a heat sink. The obverse side of the silicon substrate is provided with a concave cavity in a machined mode, and the concave cavity is used for accommodating the LED flip chip. The length of the bottom of the concave cavity is identical to the length of the LED flip chip. The reverse side of the silicon substrate is provided with two through holes in a machined mode, and the two through holes are communicated with the concave cavity. Insulating layers are deposited on the surface of the concave cavity and the surfaces of the two through holes. A radiating metal layer and a reflecting metal layer are deposited on the insulating layer on the surface of the concave cavity. Metal bodies are filled in the two through holes. The metal bodies in the through holes are connected with the radiating metal layer on the surface of the concave cavity. An opening is formed between two metal layers at the inner bottom of the concave cavity and used for isolating the metal layers into two parts. An insulating layer is deposited on the reverse side of the silicon substrate, and a metal layer is arranged on the surface of the insulating layer in a wiring mode and used for electrode connection. Fluorescent powder is coated in the concave cavity. The periphery of the concave cavity is provided with an annular positioning cavity in a machined mode, and the annular positioning cavity is used for fixing the lens. The wafer level packaging structure, method and product for the LED flip chip can improve LED luminous efficiency, enhance heat dissipation capability and finish self alignment.