Measuring module for wafer manufacturing equipment

There is described a measuring module for measuring in particular the surface of wafers with a measuring device and a measuring table, which has a rotary drive is provided with a wafer stage. This measuring module should be as compact as possible. For this purpose, the wafer stage (10) comprises a cup-shaped form with at least one bearing edge (13, 14) for a wafer (4, 4a, 4b), which is provided with an adhesive material. Inside of the wafer stage (10) a Waferausrichteinrichtung (30) is arranged. Above the wafer stage a movable measuring head (7) is arranged, in which a measuring device and a notch detector are integrated.