Wafer edge polishing method and edge polishing machine suction cup

The invention discloses a wafer edge polishing method and an edge polishing machine. The method comprises the steps of obtaining an edge polishing command input by a user, outputting a first preset rotating speed signal used for controlling an edge polishing machine suction cup to rotate at a first rotating speed when the edge polishing mode command is a rapid edge polishing command, obtaining and recording the number of rotating turns of the suction cup in real time, judging whether the number of rotating turns of the suction cup reaches a preset value, outputting a second preset rotating speed signal used for controlling an edge polishing machine rotating disc to rotate at a second rotating speed if the number of rotating turns of the suction cup reaches the preset value, judging whether the number of rotating turns of the suction cup is equal to a preset number of edge polishing turns, and outputting a control signal used for controlling the edge polishing machine to stop polishing edges if the number of rotating turns of the suction cup is equal to the preset number of edge polishing turns. Accordingly, when needing to increase the edge polishing speed, the user can input the rapid edge polishing command, so that in the wafer edge polishing process, the suction cup rotates at the first rotating speed at the beginning, and when the number of rotating turns of the rotating disc reaches the preset value, the control signal is output to enable the suction cup to rotate at the second rotating speed; thus, the edge polishing time of wafers can be adjusted by the user according to requirements of the user.