Method for electroplating goldfinger with thick gold layer

The invention discloses a method for electroplating a goldfinger with a thick gold layer. The method comprises the following processes: a, using copper-clad plate to etch an outer circuit, and forming a goldfinger leading wire; b, coating a coating material so as to form a gold-plating finger area; c, carrying out electronickelling on the gold-plating finger; d, electrogilding on the nickel layer of the gold-plating finger area; and e, removing the goldfinger leading wire and forming a solder mask, wherein a nickel aminosulfonate electroplating liquid is used in the process c for the electronickelling of the gold-plating finger area; and a nickel sulfonic acid electroplating liquid is a mixed solution of 300-600g/L nickel aminosulfonate, 20-50g/L boric acid and 30-70g/L nickel chloride. According to the method, the nickel aminosulfonate electroplating liquid is selected for the electronickelling of the gold-plating finger area, so that the electronickelling efficiency is high, the surface of the electronickelling layer is smooth and does not have residual stress, and the subsequent gold layer can be stably plated without gold throwing; and the goldfinger plated by the method is particularly suitable for electroplating gold layers with the thickness above 30 microinches, the nickel layer can be effectively prevented from being exposed, and the quality of the produced goldfinger can be greatly improved.