Method of substrate treatment, substrate treating apparatus and substrate treating system

A method of substrate treatment comprising, with the use of a sheet-feed substrate treating apparatus provided with a first treatment position for introducing of nitrogen atoms in a highly dielectricfilm and a second treatment position for heat treatment of the highly dielectric film, sequentially delivering multiple substrates to be treated one by one to the first and second treatment positionsto thereby sequentially carry out the nitrogen atom introduction treatment and heating treatment on the highly dielectric film of the substrates to be treated, wherein after the treatment in the firsttreatment position, treatment of the resultant substrates in the second treatment position is begun within 30 sec.