Plating Opportunities in 3D

Through Silicon Via's (TSV) are one of the key enabling technologies towards 3D packaging. Copper electroplating is frequently mentioned as candidate to fill TSV's besides polySi or ink-jetting conductive inks and attracts high attention. In addition to copper plating solder plating offers the next opportunity. Last but not least the ultimate target of an “all wet TSV” where also barrier and seed layers are electroplated, was demonstrated already. This paper targets to introduce the 3D related plating technologies and will encourage a discussion about targets to be meet in order to enable 3D. Even so copper plating is well introduced to the IC industry for Dual Damascene plating, TSV copper filling challenges the plating technology. One of the reasons why is that TSV dimensions are almost one magnitude larger than dual damascene structures. So in order to meet the industries target of fast and void free copper filling, type and function of organic additives applied in copper plating bathes need to be re i...