Metal wiring structure for an integrated circuit

The present invention discloses a device comprising a substrate, a metal pad over the substrate, and a metal pad is electrically disconnected from the metal traces. Metal pads and metal traces flush with each other. The passivation layer includes an edge portion overlapping with a portion of the metal pad. Metal pillar covering over the metal pad and the pad is electrically disconnected from the metal. Metal traces having a portion overlapping the metal post. The present invention also discloses a metal wiring structure for an integrated circuit.