Thermal Conduction Phenomena in Advanced Interface Materials for Electronics Cooling
2005
Thermal resistances at packaging interfaces are occupying a larger portion of the overall thermal resistance from a semiconductor die to ambient. Substantial improvement of the performance of thermal interface materials (TIMs) is required to achieve effective electronic cooling. This report is a brief review of the current status of TIM research. Particular focus is given to the fundamental understanding of heat conduction phenomena in polymer-based TIM composites at packaging interfaces in thin-film form. Promising nanostructured TIMs for future applications are also discussed.Copyright © 2005 by ASME
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI