GRAPHITE CREEP NEGATION DURING FLASH SPARK PLASMA SINTERING UNDER TEMPERATURES CLOSE TO 2000 °C

Abstract Graphite creep has high importance for applications using high pressures (100 MPa) and temperatures close to 2000 °C. In particular, the new flash spark plasma sintering process (FSPS) is highly sensitive to graphite creep when applied to ultra-high temperature materials such as silicon carbide. In this flash process taking only a few seconds, the graphite tooling reaches temperatures higher than 2000 °C resulting in its irreversible deformation. The graphite tooling creep prevents the flash spark plasma sintering process from progressing further. In this study, a finite element model is used to determine FSPS tooling temperatures. In this context, we explore the graphite creep onset for temperatures above 2000 °C and for high pressures. Knowing the graphite high temperature limit, we modify the FSPS process so that the sintering occurs outside the graphite creep range of temperatures/pressures. 95 % dense silicon carbide compacts are obtained in about 30 s using the optimized FSPS.