Old Web
English
Sign In
Acemap
>
Paper
>
Achieving BEOL Footprint-Efficient and Low Cost Monolithic 3D + IoT Chip Using Low Thermal Budget Laser Technology
Achieving BEOL Footprint-Efficient and Low Cost Monolithic 3D + IoT Chip Using Low Thermal Budget Laser Technology
2017
C.C. Yang
Keywords:
Internet of Things
Laser
Chip
Electronic engineering
Materials science
Automotive engineering
Computer science
Footprint
Thermal
laser technology
Correction
Source
Cite
Save
Machine Reading By IdeaReader
1
References
0
Citations
NaN
KQI
[]