Impingement/effusion cooling of electronic components with cross-flow

Abstract In this study, impingement/effusion cooling with cross-flow of in-line array of electronic components (ECs) is investigated numerically using RNG k-ɛ turbulence model. The cooling process is examined for two channel base configurations i.e., solid board (SB) and perforated board (PB). Effects of effusion perforation diameter ( d / l ) and its position ( s / l ) are considered on flow structure, temperature contours, heat transfer, and friction coefficient for different jet-to-cross Reynolds number ratios ( Re R ). Throughout the experiments, the jet position is kept at the third EC [1] . The results show that utilizing perforated board generates a new E vortex behind each component and the magnification of the wake vortex depends substantially on both perforation diameter and position. The ratio of average heat transfer coefficient ( h ¯ R ) on the rear faces of ECs decreases with increasing s/l ; while, it increases with increasing d/l . As well, d / l has a significant effect on friction coefficient; while, Re R and s/ l have inconsiderable effect. Furthermore, the highest value of performance evaluation criteria (PEC) that is accomplished at the largest perforation diameter for the closest one, equals to 1.36 at Re R of 0.5. Also, a proposed correlation is presented to estimate PEC for PB as a function of Re R , d / l , and s/l .