Old Web
English
Sign In
Acemap
>
Paper
>
Effect of Cryogenic Storage on Reliability of the BGA Interconnect Solder Joint
Effect of Cryogenic Storage on Reliability of the BGA Interconnect Solder Joint
2018
Xing Fu
Yunfei En
Bin Ma
Ruohe Yao
Bin Zhou
Yun Huang
Keywords:
Ball grid array
Soldering
Materials science
Composite material
Mechanical engineering
Interconnection
Correction
Source
Cite
Save
Machine Reading By IdeaReader
5
References
1
Citations
NaN
KQI
[]