Conductive particles, anisotropic conductive material, and a conductive connection structure

The present invention, breakage hardly occurs due to the destruction of the connection interface between the falling electrode and conductive fine particles be subjected to any impact due to such heating and cooling even under repeated fatigue hard conductive particles, the conductive fine particles anisotropic conductive material formed using, and aims to provide a conductive connection structure. The present invention, on the surface of the core particles made of a resin or a metal, at least a conductive metal layer, a barrier layer, a copper layer, and a solder layer containing tin is conductive particles are laminated in this order, the copper layer and is in contact with the solder layer directly, the ratio of copper in the copper layer in direct contact with the solder layer to tin contained in said solder layer is conductive particles is 0.5 to 5 wt%.