Study of Electrochemical Behaviour and Surface Morphology of Copper Electrodeposit from Electrorefining with Lignin-Based Biopolymer and Thiourea as Additives

Effect of single addition of a lignin-based biopolymer additive, DP 2782, at various dosages as well as in combination with thiourea on cathode polarization during copper deposition was investigated by performing potentiodynamic and galvanostatic measurements using a potentiostat. The result of electrochemical measurements was compared with the behaviour of cathode deposition with glue and thiourea additives. Surface micro-appearance of the copper deposit after 1 h galvanostatic scan under current density of 330 A/m2 and various additive type and dosage was evaluated by scanning electron microscopy (SEM) examination. It was found that the addition of 2.5 mg/l biopolymer gave sufficiently polarizing effect of copper deposition. SEM examination of the cathode surface after galvanostatic scan revealed that the combination of the biopolymer with thiourea (2.5 and 3.5 mg/l) resulted in a compact deposit which is comparable with that resulted from the test with glue and thiourea.