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Plasma Etching Challenges for Porous SiOCH Integration in Advanced Interconnect Levels
Plasma Etching Challenges for Porous SiOCH Integration in Advanced Interconnect Levels
2008
T. Chevolleau
Thibaut David
Nicolas Posseme
Maxime Darnon
F. Bailly
R. Bouyssou
J. Ducote
Laurent Vallier
O. Joubert
Keywords:
Porosity
Materials science
Interconnection
Plasma etching
Optoelectronics
Correction
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