Sensor assembly and process for their preparation

It is an interconnection technology for a sensor assembly (20) comprising a sensor element (21) integrated in the upper side of circuit elements (25, 26) and a carrier (22) for the sensor element (21), suggested that the simple and robust and after the separation of the sensor elements does not require additional packaging measures to protect circuit elements and electrical connections of the sensor elements. For this purpose, the support (22) is provided with vias (23). Moreover, the sensor element (21) in flip-chip technique on the support (22) is mounted so that the top of the sensor element (21) partially through the carrier (22) is at least capped and the circuit elements (25, 26) of the sensor element (21 ) are electrically contactable via the vias (23) from the backside of the support (22).