INTERFACIAL REACTION STUDIES OF CR, NI, TI, AND PT METALLIZATION ON INP

Interfacial reactions between (100) InP and thin films of the transition metals Cr, Ni, Pt, and Ti have been studied. A thin layer of metal was deposited onto the InP substrates using e‐beam evaporation and parts of the samples were then subjected to heat treatment in vacuum for 30 min at several temperatures up to 500 °C. Separate characterizations of the metal, In, and P depth distributions were carried out using mass and energy dispersive recoil spectrometry. The different crystalline phases observed were determined using x‐ray diffraction. The near‐noble metals (Ni, Pt) formed ternary phases, while Ti and Cr formed phosphides. The phases formed were generally stable up to 500 °C with the major exception being Pt where the ternary phase decomposed to form PtIn2, PtP2, and Pt3In7.