Metallic CarbonNanotube Interconnects, PartII:aTransmission LineModel

proposed (e.g., [5]-[8]), inorder toinvestigate thepossibility to Inthis paper atransmission line modelisderived todescribehaveacommontechnology fordevices andinterconnect fabrithepropagation along single-wall carbon nanotubes, candidate cation. Theyshowmaininteresting properties: tobeusedasinterconnects innanoelectronics applications. . ascattering-free electron transport, while scaled CutechThemodelisobtained inaconsistent wayfromafluid model oftheelectron conduction alongsuchananostructure. The ny perormace (e.g.atheresisane scdeeply afce per-unit-length parameters arestrongly dependent on the effects related totheelectron inertia andthequantum fluid * amean-free pathofconduction electrons aslarge assevpressure. Thevalues ofthesignal propagation velocity, charac- eral ,um(for Cuitisaround 40nm); teristic impedance andcharacteristic damping oftheobtained transmission lineareverydifferent fromthatobtainable, in * animpressive currentsdensity allowed (upto10 elA/cm2), principle, byideally scaling theconventional techonology. A while Cuinterconnects arehighly susceptible toelectrosuccessful benchmark test withafull-wave modelispresented migration atcurrent densities higher than106A/cm2, [8]; andsomecase-studies arecarried outtoinvestigate thepossi- * anexcellent thermal conductivity (1700 ± 3000W/rnK bility tousesuchstructures asthefuture interconnects. while forCuitis 400W/rn K),whichmaymitigate theproblem ofheatdissipation inscaled technologies.