Paste of copper raw material and ceramics package

PURPOSE: To provide paste whose raw material is copper including a high fusing point metallic additive for the purpose of highly densified control of copper filled via and wiring for ceramics substrate, particularly for sintered-made via and thick film wiring. CONSTITUTION: Such paste as using, as its raw materials, copper placed in form of wiring and via on a multi-layer wiring substrate includes copper particles as the main component of the paste, high fusing point metallic adhesive selected from a group consisting of chromium, tantalum and tungsten and an organic material. Any paste which uses this copper as a raw material is particularly applied to formation of via and wiring inside of a ceramics package having this copper to which via and wiring are added as a main composition.