Square dielectric interconnect for chip-to-chip THz communication

A square holey cladding waveguide is designed and fabricated to support TE and TM polarizations for 180 GHz to 360 GHz chip-to-chip communication. The mode profile and normalized output power of the waveguide are simulated. A fabricated waveguide is tested using a vector network analyzer for mode mapping and loss measurements. The mode profile was mapped using a 250 μm pinhole stepped across the waveguide cross section. The waveguide loss is measured using a free space dielectric material characterization method. Here a taper with an aperture comparable to the core size was used. The taper provides easy alignment and higher coupling efficiency.