Pulsed Electrodeposition of Ni with Uniform Co-Deposition of Micron Sized Diamond Particles on Copper Substrate

Nanocrystalline nickel was deposited on annealed copper substrate of unit surface area (1 cm2) via pulsed electrodeposition technique using potentiostat (model 263A, Princeton Applied Research, USA) from Watts bath containing nickel sulfate, nickel chloride ,boric acid and sodium citrate. Diamond particles of three different dimensions, viz., 1, 3, and 6 micron were added separately (5 g/L) to the watts bath and co-deposited along with nanocrystalline nickel. The temperature was kept constant at 55 °C. The solution was ultrasonicated for 45–60 minutes prior to deposition to disperse the diamond particles uniformly in the bath. Depositions were carried out at different current densities, viz., 50, 100,150 and 200 mA/ cm2 for different durations, i.e.7, 14 and 21 minutes and best results are optimized for 200mA/cm2 so it is used for all process here .Scanning electron micrographs (SEM) show uniform deposition of microstructure of micron diamond on the surface of copper embedded in the nickel matrix. Elemental mapping confirmed uniform deposition of nickel and diamond with almost no cracks or pits. Mechanical properties of the sample such as, Vicker’s hardness increased abruptly after the electrodeposition. Improved microstructural and mechanical properties were found in the case of electrodeposited surfaces containing followed by 3 and 6 micron diamond. The properties were also found better than those processed via stirring the solution during deposition.