Bonding substrates by means of a one-component polyurethane adhesive

A method for bonding substrates comprising at least the steps of - applying a one-component polyurethane adhesive to at least one of the substrates to be bonded, the one-component polyurethane adhesive of at least one propellant selected from dimethylether, 1,1-difluoroethane (R 152a) and dimethoxymethane (methylal), and from a pressure vessel in the form of a foam is applied, and - then compressing the substrates to be bonded, and One-component polyurethane adhesive for use in this process, containing - 30 to 70 wt .-% of at least one compound having two or more, where applicable capped isocyanate groups, - 20 to 60 wt .-% of at least one compound having at least two hydroxyl groups, - 0.01 to 2.5 wt .-%, at least a curing catalyst, - from 5 to 49.99 wt .-% of at least one blowing agent, and - 0 to 10 wt .-% of at least one foam stabilizer, each based on the total weight of the one-component polyurethane adhesive, wherein the proportion of dimethyl ether, 1,1-difluoroethane and dimethoxymethane, based on the total amount of blowing agent contained, is at least 50 wt .-%.