Flip chip bonded optoelectronic devices on ultra-thin silicon-on-sapphire
2001
We describe flip chip bonding of arrayed optoelectronic devices (VCSELs, MSM and PIN detectors) onto ultra-thin silicon-on-sapphire (UTSi). We present results of UTSi optical transmitters and receivers for 2.5 Gbps (and higher) parallel optical links.
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