Phenolic moulding plastic for low-voltage apparatus

The invention discloses a phenolic moulding plastic for a low-voltage apparatus, which belongs to the technical field of thermosetting moulding plastic. The phenolic moulding plastic comprises the following raw materials in portions by weight: 20 to 40 portions of phenolic resin, 10 to 30 portions of thermosetting resin, 4 to 10 portions of curing agent, 5 to 15 portions of reinforcing fibers, 10 to 20 portions of nano reinforcing powder, 0.5 to 2.0 portions of coupling agent, 0.2 to 2.0 portions of releasing agent, and 5 to 10 portions of inorganic filler. The phenolic moulding plastic provided by the invention has the advantages of excellent electrical insulation performance and ideal arc resistant performance; the comparative tracking index (CTI) value of the plastic can reach 300V; and the plastic can be directly used for manufacturing low-voltage apparatuses without carrying out dip coating and surface treatment on the plastic.