Multi-wire cutting device with rocker mechanism

The invention discloses a multi-wire cutting device with a rocker mechanism, and relates to the technical field of cutting devices. The multi-wire cutting device comprises a plurality of steel wires and two guide wheels, wherein each steel wire is sleeved in slots of the two symmetric guide wheels, and the two steel wires respectively penetrate in the two guide wheels and control the guide wheels. The multi-wire cutting device is characterized by comprising a workpiece descending device, and the rocker mechanism is arranged on the workpiece descending device. The workpiece-descending type multi-wire cutting device is provided with the mechanism capable of driving a workpiece to rock, and is mainly used for processing materials such as silicon wafers, sapphires and SiC which are difficult to cut. The multi-wire cutting device has the advantages that the distances among the steel wires and the guide wheels can be reduced, a body of the rocker mechanism is minimized, (the quantity of high-precision and expensive components required by equipment can be minimized), and effects of lowering and controlling manufacturing cost of the device are realized.