Acoustic signal/electric signal converting package and substrate for the same
2009
PURPOSE: An acoustic/electric conversion package and a substrate for the same are provided to extend arrangement area of an electric/electronic element, by improving the material of the substrate with a ceramic material. CONSTITUTION: A cover container covers a substrate(40) as comprising an acoustic inlet hole. The cover container defines a chamber region separated from the outside. An acoustic/electric conversion device(110) is arranged on the substrate. The acoustic/electric conversion device converts an acoustic signal from the acoustic inlet hole into an electric signal. A signal processing circuit set(130) is arranged on the substrate. The signal processing circuit set supplies an operation voltage to the acoustic/electric device. The signal processing circuit set processes the converted electric signal. The substrate is formed with a ceramic material. The electric/electronic device is installed in the substrate.
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