Vertical laminated optical path module and multi-die semiconductor laser

The invention relates to the technical field of laser, and particularly relates to a vertical laminated optical path module and a multi-die semiconductor laser. The vertical laminated optical path module comprises a heat sink module and N optical path units, N being a positive integer larger than or equal to 2. Each optical path unit comprises a semiconductor laser chip CoS with auxiliary heat sink, a fast axis collimating lens and a slow axis collimating lens. One surface of the heat sink module is in the shape N+1 steps, from the first step to the N+1 steps from low to high, wherein the first step is provided with N-1 lens frames. The multi-die semiconductor laser comprises a step-shaped bottom board and a plurality of vertical laminated optical path modules, wherein the plurality of vertical laminated optical path modules are fixed to the different steps of the step-shaped bottom board respectively. According to the vertical laminated optical path module and the multi-die semiconductor laser, modularization of a plurality of optical paths are realized, process repeatability and stability are guaranteed, and space utilization rate of the multi-die semiconductor laser is improved.