Printing functional substrate for flexible electronics

With the rapid development of electronics industry, the printed circuit board (PCB) is the most important indispensable components for various kinds of products such as military, medical, appliances and consumer electronics. At the beginning, the construction of integration of electronic components by PCB process is single layer and double layer process. Until now, the yield of multilayer process with a lot of packaging technology is very high and the stability is good. However, all the traditional PCB process is photolithography process. This procedure is not only using a lot of chemicals and special materials, but also making a variety of organic and heavy metals pollutions. Besides, the equipment of photolithography process is very expensive. Therefore, the target of electronics industry in the future are green manufacturing process and relatively low equipment costs.