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In-Situ Measurements of Stress during Electrodeposition of Copper Nanofilms: Effects of Deposition Rate and Grain Size
In-Situ Measurements of Stress during Electrodeposition of Copper Nanofilms: Effects of Deposition Rate and Grain Size
2017
D. Noel Buckley
Joe A. Murphy
Catherine Lenihan
Eric Chason
Robert P. Lynch
Keywords:
Copper
Grain size
Materials science
In situ
Metallurgy
deposition rate
Correction
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