Fabrication and Benchmarking of a Stratix V FPGA with Monolithic Integrated Microfluidic Cooling

Abstract : Microfluidic cooling has been demonstrated asan effective means of cooling microelectronic circuits dueto its very low convective thermal resistance and potentialfor integration in close proximity to the area of heatgeneration. However, microfluidic experiments to datehave been limited to silicon with resistive heatersrepresenting the heat generating circuitry. In this work, amicropin-fin heat sink is etched into the back side of anAltera Stratix V FPGA, built in a 28 nm CMOS process.Thermal and electrical measurements are made running abenchmark pulse compression algorithm on the FPGA.Deionized water is used as a coolant with flow ratesranging from 0.15mL/s to 3.0mL/s. An average junction to-inlet thermal resistance 0.07 C/W is achieved.