Method and apparatus for laser to induce plasma to inject into substrate

The invention relates to a method and apparatus for a laser to induce plasmas to inject into a substrate and is directed to the fields of plasma injection apparatus and plasma injection material processing technology. A high energy burst pulse strong laser initiated by a laser impacts on tinsel which absorbs the high energy burst pulse laser energy. The high energy burst pulse laser energy is instantly gasified and ionized, thereby producing hot plasmas. The hot plasmas are composed of metal ions, electrons and uncharged atoms. The plasmas absorb subsequent laser energy to expand and blast. During the blast process of the plasmas, an expulsive force between the electrons and a workpiece connected to the negative potential drives the electrons to move against the workpiece. A positive charge plate neutralizes a part of the electrons. Suction between positive valency metal ions and the negative potential workpiece drives the metal ions to move towards the workpiece. Under the superposedeffects of a shock wave effect formed in the expansion and blast of the plasmas and an attraction effect of an electric field, the metal ions hit on the workpiece at a great speed; hence the injection of the metal ions is completed.