Interposing of Microelectronics by Micro Transfer Printing to Create 3-D Structures

Micro transfer printing (µTP) is a useful method for heterogenous integration of micro-scale devices but typically requires additional electrical interconnection of devices following print. In this paper, the concept of interconnect at print is explored and a stacked configuration demonstrating electrical interconnection of 3-D micrometer scale electrical devices is shown. Structures that are 45µm by 25µm consisting of four metallized spikes on the bottom and recessed pyramids at the top are stacked, probed, and shown to illuminate light demonstrating their electrical interconnection from print.