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Fully Superconducting Multi-Chip Module Process with Controlled Interchip Spacing for Quantum Integrated Circuits
Fully Superconducting Multi-Chip Module Process with Controlled Interchip Spacing for Quantum Integrated Circuits
2018
Daniel Yohannes
Denis Amparo
John A. Vivalda
Mario Renzullo
Jason Walter
Mykola Chernyashevskyy
Andrei Talalaevskii
O. Chernyashevskyy
Igor V. Vernik
Oleg A. Mukhanov
Keywords:
Superconductivity
Multi-chip module
Electronic engineering
Materials science
Integrated circuit
Quantum
Electrical engineering
Computer science
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