Super-high-power IC chip package and production method thereof

The invention discloses a super-high-power IC chip package and a production method thereof, the package comprises a frame body on which six packaging body are arranged in parallel, the frame body is formed by riveting six lead frames in single row, wherein the lead frame is a riveting frame adopted anti-overflow material designed, each lead frame is provided with a package; the frame body formed by riveting six lead frames is riveted with a lead frame supporter, and a single-chip package, a dual-chip package or a dual-chip stacked package is manufactured on the lead frame supporter according to the requirement so as to obtain the super-high-power IC chip package. The package is characterized in super-high power and strong radiating ability for solving the disadvantages of the traditional high-power semiconductor apparatus; the package is simple and rational in structure, thinner and lighter, low in cost, environmentally friendly, high in performance and reliability, which is widely applied in national defense construction and national economic construction field such as aviation, train, vehicle, communication, computer, consumer electronics and so on.