Polishing method of work

The polishing method of the present invention has a holding hole for holding the workpiece 1 or more, at least one of said holding hole is a workpiece held on a carrier plate which is arranged eccentrically, while supplying a polishing slurry, the polishing pad by rotating at least the carrier plate between the upper platen and the lower platen that affixed to the a method of polishing the front and back surfaces of the workpiece at the same time, the temperature of the carrier plate is measured, the measured temperature of the carrier plate based on the change, and controlling the amount of polishing of the workpiece (wafer).